Diamond pad with 1 or 2pcs metal bond parallelogram segments for EZ change plate of HTC grinding machines, suitable for general (concrete, terrazzo, stone) floor grinding use, while mostly they are used for paint, glue, epoxy removal and floor coating.

Metal bond diamond segment has high strength, excellent wear resistance, and a low friction coefficient, it also has high grinding efficiency and low grinding force generates less heat in the grinding process.

The parallelogram segment is ideal for removing heavy coating, it is extremely aggressive leaving and deep to medium scratch pattern,  taking the floor from coarsely structured surface to pre-polishing.

Code No.

Segment No.

Segment Size

Grit No.

Connection

CD-DGP-HTC-06-1

1

37*18*13mm

Soft

Medium

Hard

#6, #16, #20, #25, #30, #40, #50, #60, #80, #100, #120, #150, #170, #200

HTC EZ change plate

CD-DGP-HTC-06-2

2