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Diamond Grinding Pads
 Trapezoid
Pads
for
HTC machines
for
Husqvarna
machines
for Lavina
machines
Products
Quick View
 Diamond Drill Bits
Diamond Grinding
Cup Wheels
Diamond Grinding Pads
Diamond
Grinding Discs
Diamond Plugs
Diamond Polishing
Pads
Diamond Saw Blades
Diamond Segments
Diamond Wire Saw
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Diamond Grinding Pads
for EZ Change Plate of HTC Floor Grinders - Round Segments
Diamond pad with 1-3pcs
metal bond round segments for EZ change plate of HTC grinding
machines, suitable for general (concrete, terrazzo, stone) floor
grinding use, while mostly they are used for paint, glue, epoxy
removal and floor coating.
Metal bond diamond segment has high strength, excellent wear
resistance, and a low friction coefficient, it also has high
grinding efficiency and low grinding force generates less heat in
the grinding process.
The round
segment is ideal for removing heavy coating, it is extremely aggressive
leaving and deep to medium scratch pattern,
taking the floor from coarsely structured surface to
pre-polishing.
Advantage: very efficient for the toughest situations such as the
removal of very persistent coating, and the high diamond
concentration provides for a faster grinding rate while the high
quality of the diamonds provides longer grinding life.
Features: excellent wear resistance, lower cost, better surface
finish etc.
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Code No. |
Segment No. |
Segment Size |
Segment Bond |
Grit No. |
Connection |
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CD-DGP-HTC-03-1 |
1 |
Ø18x13mm |
Soft
Medium
Hard |
#6, #16, #20, #25, #30,
#40,
#50, #60,
#80,
#100, #120,
#150,
#170,
#200 |
HTC EZ
change plate |
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CD-DGP-HTC-03-2 |
2 |
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CD-DGP-HTC-03-3 |
3 |
The about specifications & photos is for reference,
special logo, segment size
may be available as per demand.
Relevant Products:
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